JPS6320471U - - Google Patents
Info
- Publication number
- JPS6320471U JPS6320471U JP11273586U JP11273586U JPS6320471U JP S6320471 U JPS6320471 U JP S6320471U JP 11273586 U JP11273586 U JP 11273586U JP 11273586 U JP11273586 U JP 11273586U JP S6320471 U JPS6320471 U JP S6320471U
- Authority
- JP
- Japan
- Prior art keywords
- circuit component
- orthogonal
- soldering
- mount type
- side surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986112735U JPH0427183Y2 (en]) | 1986-07-24 | 1986-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986112735U JPH0427183Y2 (en]) | 1986-07-24 | 1986-07-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6320471U true JPS6320471U (en]) | 1988-02-10 |
| JPH0427183Y2 JPH0427183Y2 (en]) | 1992-06-30 |
Family
ID=30993884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986112735U Expired JPH0427183Y2 (en]) | 1986-07-24 | 1986-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427183Y2 (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010109535A (ja) * | 2008-10-29 | 2010-05-13 | Nippon Dempa Kogyo Co Ltd | セット基板に対する表面実装水晶発振器の実装方法 |
| JP2015159253A (ja) * | 2014-02-25 | 2015-09-03 | ファナック株式会社 | プリント基板 |
| JP2016213308A (ja) * | 2015-05-08 | 2016-12-15 | キヤノン株式会社 | プリント回路板及びプリント配線板 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3777221A (en) * | 1972-12-18 | 1973-12-04 | Ibm | Multi-layer circuit package |
| JPS55164867U (en]) * | 1979-05-15 | 1980-11-27 | ||
| JPS59145592A (ja) * | 1984-01-17 | 1984-08-21 | 株式会社ケンウッド | 印刷配線基板への電子部品の取付法 |
| JPS60182750A (ja) * | 1984-02-29 | 1985-09-18 | Fujitsu Ltd | 実装基板 |
| JPS6120078U (ja) * | 1984-07-11 | 1986-02-05 | 日本ビクター株式会社 | プリント配線板 |
-
1986
- 1986-07-24 JP JP1986112735U patent/JPH0427183Y2/ja not_active Expired
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3777221A (en) * | 1972-12-18 | 1973-12-04 | Ibm | Multi-layer circuit package |
| JPS55164867U (en]) * | 1979-05-15 | 1980-11-27 | ||
| JPS59145592A (ja) * | 1984-01-17 | 1984-08-21 | 株式会社ケンウッド | 印刷配線基板への電子部品の取付法 |
| JPS60182750A (ja) * | 1984-02-29 | 1985-09-18 | Fujitsu Ltd | 実装基板 |
| JPS6120078U (ja) * | 1984-07-11 | 1986-02-05 | 日本ビクター株式会社 | プリント配線板 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010109535A (ja) * | 2008-10-29 | 2010-05-13 | Nippon Dempa Kogyo Co Ltd | セット基板に対する表面実装水晶発振器の実装方法 |
| JP2015159253A (ja) * | 2014-02-25 | 2015-09-03 | ファナック株式会社 | プリント基板 |
| US9872388B2 (en) | 2014-02-25 | 2018-01-16 | Fanuc Corporation | Printed wiring board |
| JP2016213308A (ja) * | 2015-05-08 | 2016-12-15 | キヤノン株式会社 | プリント回路板及びプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0427183Y2 (en]) | 1992-06-30 |